LTCC is the abbreviation of 'Low Temperature Co-fired Ceramic'. This technology is a way to produce low cost ceramic multilayer circuits using single soft tapes, which are used to apply conductive, dielectric, or resistive pastes on. It is well suited to realize innovative RF and microwave components and sub-systems.

Compared to a conventional multi-layer laminate structure, such as FR4, LTCC offers a number of advantages:

  1. Lower loss dielectric.
  2. Better controlled dielectric properties.
  3. Well suited to producing modules in low-cost SMT packages (BGA, QFP, PLCC, etc..) as well as bare dies.
  4. Cavities and integral heat sinks can be easily realized.
  5. Capability to include embedded passive components such as resistors, capacitors and inductors.

A 3-dimensional image of an LTCC assembly incorporating a bare die, SMT components and integrated passives is shown below.